Introduction

Bosch Sensortec offers a toolkit for evaluation of it’s sensor products.The toolkit consisting of 3 elements:

• A sensor specific shuttle board also known as breakout board. APP3.0 shuttle boards also known as mini shuttle boards has smaller form factor when compared with APP2.0 shuttle board.

Fig. 1: APP2.0/3.0 shuttle board

• Application Board has a connector for the shuttle board and serves as interface translator from the sensor interface (I₂C or SPI) to a USB interface, allowing PC software to communicate with the sensor on the shuttle.

Fig. 2: Application Board 2.0/3.0

• Nicla Sense ME board combines four state-of-the-art sensors from Bosch Sensortec (BHI260AP, BMP390, BMM150 and BME688) in the Arduino ecosystem.

Fig. 3: Nicla Sense ME

• On the PC side, Bosch Sensortec provides the software packages Development Desktop 2.0 and COINES to connect to the sensor on the Application Board.

  • Development Desktop 2.0 provides a GUI which allows to configure the sensor, plot and export streamed sensor data.

  • COINES provides a C based interface, which allows to communicate with the sensor using the SensorAPI from Bosch Sensortec on the PC side.

  • Starting from COINES v2.0, user has an option to cross-compile the example and run it directly on the Application Board’s microcontroller.